That is the modern CPU, he did it on a C2D. Too much won't yield you as big of temperature drops, but it's much better than too little.Scorpion0x17 wrote:
D'u not just goop a load over the whole thing with modern CPUs then?
Yeah, I do know that that is the CPU. What I meant was, when I Artic Silvered my AthlonXP 3200+, the general concesus seemed to be to slap a thin, but not too thin layer all over the top of the chip, whereas that appears to be just a small line in the middle (or do you then spread it out from there?)._j5689_ wrote:
That is the modern CPU, he did it on a C2D. Too much won't yield you as big of temperature drops, but it's much better than too little.Scorpion0x17 wrote:
D'u not just goop a load over the whole thing with modern CPUs then?
Everyone says you should spread it from there. I think that the heatsink smashing it all over would do the job but that particular glob looks way to small for that, lol.Scorpion0x17 wrote:
Yeah, I do know that that is the CPU. What I meant was, when I Artic Silvered my AthlonXP 3200+, the general concesus seemed to be to slap a thin, but not too thin layer all over the top of the chip, whereas that appears to be just a small line in the middle (or do you then spread it out from there?)._j5689_ wrote:
That is the modern CPU, he did it on a C2D. Too much won't yield you as big of temperature drops, but it's much better than too little.Scorpion0x17 wrote:
D'u not just goop a load over the whole thing with modern CPUs then?
Ah, k, that answers my question._j5689_ wrote:
Everyone says you should spread it from there. I think that the heatsink smashing it all over would do the job but that particular glob looks way to small for that, lol.Scorpion0x17 wrote:
Yeah, I do know that that is the CPU. What I meant was, when I Artic Silvered my AthlonXP 3200+, the general concesus seemed to be to slap a thin, but not too thin layer all over the top of the chip, whereas that appears to be just a small line in the middle (or do you then spread it out from there?)._j5689_ wrote:
That is the modern CPU, he did it on a C2D. Too much won't yield you as big of temperature drops, but it's much better than too little.
Arctic has new instructions for the dual core chips. you do put a thin line like that on there now.Scorpion0x17 wrote:
...What I meant was, when I Artic Silvered my AthlonXP 3200+, the general concesus seemed to be to slap a thin, but not too thin layer all over the top of the chip, whereas that appears to be just a small line in the middle (or do you then spread it out from there?).
And it shows why, the core itself is elongated in that way.signa wrote:
Arctic has new instructions for the dual core chips. you do put a thin line like that on there now.Scorpion0x17 wrote:
...What I meant was, when I Artic Silvered my AthlonXP 3200+, the general concesus seemed to be to slap a thin, but not too thin layer all over the top of the chip, whereas that appears to be just a small line in the middle (or do you then spread it out from there?).
http://www.arcticsilver.com/ins_route_s … elas5.html
Interesting, as I said earlier, the received wisdom back when I AS'd my AthlonXP, from both AMD and AS, was to do the 'small-blob-and-then-spread' method.CrazeD wrote:
You guys must not know how much pressure and how tightly the heatsink seals itself to the CPU. You do not need to thin it out, and if you do you could get bare spots or very thin spots which could cause temperature rises in that spot (though you probably won't see a difference on temperature measurements) damaging the CPU.
The correct way to do it is to put a small blob in the center of the CPU, about the size of a BB or small uncooked grain of white rice. Then, just secure your heatsink and twist it a tiny bit both ways (to make sure there are no air bubbles).
If you remove your heatsink after doing this you will notice it is perfectly spread out, in an even layer.
The part of the CPU that makes heat is the core...which is in the middle of the chip. Spreading the paste out to the edges is just wasting the grease, wasting time, and making a mess.
Why would it not give even pressure?Scorpion0x17 wrote:
Interesting, as I said earlier, the received wisdom back when I AS'd my AthlonXP, from both AMD and AS, was to do the 'small-blob-and-then-spread' method.CrazeD wrote:
You guys must not know how much pressure and how tightly the heatsink seals itself to the CPU. You do not need to thin it out, and if you do you could get bare spots or very thin spots which could cause temperature rises in that spot (though you probably won't see a difference on temperature measurements) damaging the CPU.
The correct way to do it is to put a small blob in the center of the CPU, about the size of a BB or small uncooked grain of white rice. Then, just secure your heatsink and twist it a tiny bit both ways (to make sure there are no air bubbles).
If you remove your heatsink after doing this you will notice it is perfectly spread out, in an even layer.
The part of the CPU that makes heat is the core...which is in the middle of the chip. Spreading the paste out to the edges is just wasting the grease, wasting time, and making a mess.
Does the heatsink assembly on modern CPU sockets provide more even pressure than the older setup, I wonder?
I've seen the fancy new intel assemblies - and that would appear to give more even pressue, but I've not seen AMDs...
Well, the AthlonXP uses Socket-A, whereas the AM2 uses, unsurprisingly, Socket-AM2.CrazeD wrote:
Why would it not give even pressure?Scorpion0x17 wrote:
Interesting, as I said earlier, the received wisdom back when I AS'd my AthlonXP, from both AMD and AS, was to do the 'small-blob-and-then-spread' method.CrazeD wrote:
You guys must not know how much pressure and how tightly the heatsink seals itself to the CPU. You do not need to thin it out, and if you do you could get bare spots or very thin spots which could cause temperature rises in that spot (though you probably won't see a difference on temperature measurements) damaging the CPU.
The correct way to do it is to put a small blob in the center of the CPU, about the size of a BB or small uncooked grain of white rice. Then, just secure your heatsink and twist it a tiny bit both ways (to make sure there are no air bubbles).
If you remove your heatsink after doing this you will notice it is perfectly spread out, in an even layer.
The part of the CPU that makes heat is the core...which is in the middle of the chip. Spreading the paste out to the edges is just wasting the grease, wasting time, and making a mess.
Does the heatsink assembly on modern CPU sockets provide more even pressure than the older setup, I wonder?
I've seen the fancy new intel assemblies - and that would appear to give more even pressue, but I've not seen AMDs...
I'm not sure what kind of cooler your AthlonXP had. The AMD64 coolers clamp on pretty tightly.
When using my method (just a small blob then put the HSF on) after I take it back off there is a circle of it about the size of a bottle cap (in diameter).
The thing is, if you spread it out first and THEN clamp the HSF on, it's going to keep squeezing it as it goes down. So you could get some of it to ooze down around the CPU, but you might also get very thin spots where you get temperature spikes.
Maybe the method is different for AthlonXP, but even on the AS5 website it says to put a small blob and then put the HSF on.
Last edited by Scorpion0x17 (2007-07-29 14:15:47)
Aha. Thanks. I think just about answers my question.CrazeD wrote:
The AM2 system is the same as the s939 system. It hooks onto the socket with clips, but theres also a retention lever which puts quite a lot of pressure on it. The old socket A ones you had to force it down and then struggle for 20 minutes to get it back off. The s939/AM2 ones you just pretty much clip it on and then put the retention lever down.
But, even if it is slightly uneven...that's what the grease is for, to seal it together.
Last edited by _j5689_ (2007-07-29 18:25:43)
linky no worky_j5689_ wrote:
Looks like you can even do it to an XBox or an XBox 360 if you know how to:
http://www.microsoft.com/isapi/redir.dl … ndowsmedia
Fixed.Scorpion0x17 wrote:
linky no worky_j5689_ wrote:
Looks like you can even do it to an XBox or an XBox 360 if you know how to:
http://www.microsoft.com/isapi/redir.dl … ndowsmedia
Nope, there's a lever on the actual heatsink that clamps down.Scorpion0x17 wrote:
Aha. Thanks. I think just about answers my question.CrazeD wrote:
The AM2 system is the same as the s939 system. It hooks onto the socket with clips, but theres also a retention lever which puts quite a lot of pressure on it. The old socket A ones you had to force it down and then struggle for 20 minutes to get it back off. The s939/AM2 ones you just pretty much clip it on and then put the retention lever down.
But, even if it is slightly uneven...that's what the grease is for, to seal it together.
It's that 'restling with it for 20minutes' factor of the Socket A that meant the pressure could end up die-crackingly (and goop-spoilingly) uneven.
Sounds like the 'retention lever' keeps things nice and even. Though, you don't mean the lever that holds the chip legs in place do you?